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LTC2404IG#PBF - Analog Devices

Description: Analog to Digital Converters - ADC 24-Bit Power 4/Ch Delta-Sigma ADC

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LTC2404IG#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 28-Lead Plastic SSOP (5.3mm)
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LTC2404IG#PBF - Analog Devices  - 3D model - Small Outline Packages - 28-Lead Plastic SSOP (5.3mm)
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LTC2404IG#PBF Details

  • Manufacturer Part Number:

    LTC2404IG#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.209 INCH, PLASTIC, SSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    05-08-1640 (G28)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Input Voltage-Max:

    6.1875 V

  • Analog Input Voltage-Min:

    -0.0125 V

  • Conversion Time-Max:

    163200 µs

  • Converter Type:

    ADC, DELTA-SIGMA

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Linearity Error-Max (EL):

    0.0012%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    4

  • Number of Bits:

    24

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

LTC2404IG#PBF Frequently Asked Questions (FAQs)

  • The datasheet provides some guidelines, but a good rule of thumb is to keep the analog and digital grounds separate, use a solid ground plane, and place the device close to the analog signal sources. Additionally, keep the input and output traces short and away from digital signals.
  • The device is rated for operation from -40°C to 125°C. Ensure good airflow around the device, avoid overheating, and use a heat sink if necessary. Monitor the device's temperature using a thermocouple or thermal sensor, and adjust the system design accordingly.
  • Power up the device in the following sequence: VCC, AVCC, and then the analog input signals. Ensure that the power supplies are stable and within the recommended voltage range before applying the analog input signals.
  • Use a first-in, first-out (FIFO) buffer or a similar data handling mechanism to ensure that the digital output data is processed in the correct order. Also, ensure that the digital output data is properly synchronized with the system clock and that the data is not corrupted during transmission.
  • Avoid using vias under the device, keep the analog and digital grounds separate, and avoid running digital signals under or near the device. Also, ensure that the PCB layout is symmetrical and balanced to minimize noise and electromagnetic interference (EMI).

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LTC2404IG#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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