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LTC2481CDD#PBF - Analog Devices

Description: Single Channel Single ADC Delta-Sigma 7.5sps 16-bit Serial Automotive 10-Pin DFN EP

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LTC2481CDD#PBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - 10-LEAD (3mm s 3mm) PLASTIC DFN*-*-
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LTC2481CDD#PBF - Analog Devices  - 3D model - Small Outline No-lead - 10-LEAD (3mm s 3mm) PLASTIC DFN*-*-
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LTC2481CDD#PBF Details

  • Manufacturer Part Number:

    LTC2481CDD#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    3 X 3 MM, LEAD FREE, PLASTIC, MO-229WEED-2, DFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1699

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    1.25 V

  • Analog Input Voltage-Min:

    -1.25 V

  • Conversion Time-Max:

    149900 µs

  • Converter Type:

    ADC, DELTA-SIGMA

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.001%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC2481CDD#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC2481CDD involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog-to-digital converter (ADC) to minimize noise.
  • To ensure accurate temperature measurement, it's essential to use a thermistor with a high accuracy rating, ensure good thermal contact between the thermistor and the device being measured, and calibrate the system to account for any offsets or non-linearities.
  • The maximum cable length for the LTC2481CDD's digital interface depends on the specific application and the type of cable used. As a general rule, it's recommended to keep the cable length as short as possible (less than 10 inches) to minimize signal degradation and noise.
  • While the LTC2481CDD is optimized for use with thermistors, it can be used with other types of temperature sensors, such as RTDs or thermocouples, with some modifications to the circuit and calibration. However, the accuracy and performance may vary depending on the specific sensor used.
  • To minimize EMI and RFI, use a shielded cable for the digital interface, keep the device away from sources of electromagnetic radiation, and use a low-pass filter or ferrite bead to filter out high-frequency noise.

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LTC2481CDD#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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