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LTC2484CDD#PBF - Analog Devices

Description: Linear Technology LTC2484CDD#PBF, 24-bit Serial ADC Differential Input, 10-Pin DFN

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PCB Footprints
LTC2484CDD#PBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - DD Package 10-Lead Plastic DFN (3mm × 3mm) (Reference LTC DWG # 05-08-1699 Rev C)
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3D Models
LTC2484CDD#PBF - Analog Devices  - 3D model - Small Outline No-lead - DD Package 10-Lead Plastic DFN (3mm × 3mm) (Reference LTC DWG # 05-08-1699 Rev C)
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LTC2484CDD#PBF Details

  • Manufacturer Part Number:

    LTC2484CDD#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    3 X 3 MM, LEAD FREE, PLASTIC, MO-229WEED-2, DFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1699

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    5.5 V

  • Conversion Time-Max:

    163500 µs

  • Converter Type:

    ADC, DELTA-SIGMA

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.001%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    24

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.0000075 MHz

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC2484CDD#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC2484CDD involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources to minimize noise. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure accurate measurements with the LTC2484CDD, it is essential to follow proper PCB layout and grounding techniques, use a low-noise power supply, and minimize electromagnetic interference (EMI) and radio-frequency interference (RFI). Additionally, calibrate the device regularly and use a high-quality analog-to-digital converter (ADC).
  • The maximum sampling rate of the LTC2484CDD is 15.5 ksamples/second. However, the actual sampling rate may vary depending on the specific application, noise levels, and desired accuracy.
  • No, the LTC2484CDD is designed to operate with a 2.7V to 3.6V power supply. Using a 5V power supply may damage the device or affect its performance.
  • The LTC2484CDD can be interfaced with a microcontroller using a serial peripheral interface (SPI) or inter-integrated circuit (I2C) protocol. The device provides a 3-wire SPI interface and a 2-wire I2C interface for communication with the microcontroller.

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LTC2484CDD#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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