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LTC2666IUH-16#PBF - Analog Devices

Description: Digital to Analog Converters - DAC Octal, 16-Bit, 10V VOUT SoftSpan DACs with 10ppm/ C Max Reference

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PCB Footprints
LTC2666IUH-16#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN (5mm × 5mm)
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3D Models
LTC2666IUH-16#PBF - Analog Devices  - 3D model - Quad Flat No-Lead - QFN (5mm × 5mm)
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LTC2666IUH-16#PBF Details

  • Manufacturer Part Number:

    LTC2666IUH-16#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    32

  • Manufacturer Package Code:

    05-08-1693

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Linearity Error-Max (EL):

    0.1221%

  • Moisture Sensitivity Level:

    1

  • Negative Supply Voltage-Nom:

    -15 V

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Settling Time-Nom (tstl):

    20 µs

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

LTC2666IUH-16#PBF Frequently Asked Questions (FAQs)

  • A good layout and placement for the LTC2666IUH-16#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog layer to minimize noise and ensure optimal performance.
  • The LTC2666IUH-16#PBF requires a single 3.3V or 5V power supply. It's recommended to power the device with a low-noise, low-dropout regulator. The power sequencing requirements involve powering the device in the following order: VCC, then AVCC, and finally DVCC. The power-down sequence should be reversed.
  • The LTC2666IUH-16#PBF has a maximum junction temperature of 150°C. To ensure proper heat dissipation, it's recommended to use a thermal pad or a heat sink, and to keep the device away from other heat sources. A thermal interface material can also be used to improve heat transfer.
  • The LTC2666IUH-16#PBF can be configured for different output voltage ranges by adjusting the external resistors and capacitors. The device can output voltages from 0.6V to 5.5V, with a maximum output current of 50mA. However, the output voltage range is limited by the internal voltage reference, and the device may not be able to achieve the full output voltage range with high output currents.
  • The LTC2666IUH-16#PBF is a high-frequency device and can be a source of EMI. To minimize EMI, it's recommended to use a shielded enclosure, keep the device away from other sensitive circuits, and use EMI filters or shielding on the PCB. Additionally, a low-pass filter can be used to reduce the high-frequency noise.

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LTC2666IUH-16#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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