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LTC2844IG#PBF - Analog Devices

Description: 3.3V Software-Selectable Multiprotocol Transceiver

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LTC2844IG#PBF - Analog Devices - PCB symbol
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LTC2844IG#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - SSOP
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LTC2844IG#PBF - Analog Devices - 3D model - Small Outline Packages - SSOP
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LTC2844IG#PBF Details

  • Manufacturer Part Number:

    LTC2844IG#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    5.30 MM, PLASTIC, SSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    05-08-1640 (G28)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; V.10; V.11; V.28; V.35; V.36; X.21; EIA-422; EIA-423; EIA-449; EIA-530; EIA-530-A

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    500 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Nom:

    8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2500 ns

  • Width:

    5.3 mm

LTC2844IG#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2844IG#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The LTC2844IG#PBF requires a single 3.3V or 5V power supply. It's recommended to use a low-noise, low-dropout regulator to power the device. Power sequencing is not critical, but it's recommended to power up the device after the power supply has stabilized.
  • The LTC2844IG#PBF can achieve data transfer rates of up to 100 Mbps, but the actual data transfer rate depends on the specific application, PCB layout, and system design.
  • To troubleshoot issues with the LTC2844IG#PBF, start by checking the power supply and PCB layout for noise and signal integrity issues. Use an oscilloscope to verify the signal quality and check for errors in the data transmission. Also, review the device's configuration and programming to ensure it's set up correctly.
  • The LTC2844IG#PBF has a maximum junction temperature of 150°C. To ensure safe operation, keep the device away from heat sources, use a heat sink if necessary, and ensure good airflow around the device. Monitor the device's temperature and adjust the system design as needed to prevent overheating.

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LTC2844IG#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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