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LTC2863MPS8-1#PBF - Analog Devices

Description: ±60V Fault Protected 3V to 5.5V RS485/RS422 Transceivers

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LTC2863MPS8-1#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8 Package 8-Lead Plastic Small Outline(Narrow .150 Inch)
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LTC2863MPS8-1#PBF Details

  • Manufacturer Part Number:

    LTC2863MPS8-1#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SO-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1610 (S8)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000005 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9025 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.003 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    65 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.752 mm

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    50 ns

  • Width:

    3.899 mm

LTC2863MPS8-1#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2863 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, the voltage rating of the capacitors should be suitable for the application.
  • The maximum ambient temperature range for the LTC2863 is -40°C to 125°C. However, the junction temperature should not exceed 150°C.
  • Yes, the LTC2863 is suitable for high-reliability and aerospace applications. It is manufactured and tested to meet the requirements of these industries, and it is available in a variety of packages, including a ceramic package for high-reliability applications.
  • To troubleshoot issues with the LTC2863, start by checking the input voltage, output voltage, and current. Verify that the component values and PCB layout match the recommended design. Use an oscilloscope to check for oscillations or noise on the output. If the issue persists, consult the datasheet and application notes for further guidance.

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LTC2863MPS8-1#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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