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LTC2872CUHF#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LTC2872CUHF#PBF - TRANSCEIVER, DUAL, RS232/RS485,38QFN

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PCB Footprints
LTC2872CUHF#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UHF (38-Lead QFN)
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3D Models
LTC2872CUHF#PBF - Analog Devices  - 3D model - Quad Flat No-Lead - UHF (38-Lead QFN)
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LTC2872CUHF#PBF Details

  • Manufacturer Part Number:

    LTC2872CUHF#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    5 X 7MM, LEAD FREE, PLASTIC, MO-220WHKD, QFN-38

  • Pin Count:

    38

  • Manufacturer Package Code:

    05-08-1701

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES AS TWO RS485 DIFFERENTIAL TRANSCEIVER PAIR

  • Differential Output:

    NO

  • Driver Number of Bits:

    4

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; EIA-422

  • JESD-30 Code:

    R-PQCC-N38

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    10 V

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC38,.2X.28,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    200 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2000 ns

  • Width:

    5 mm

LTC2872CUHF#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use short, wide traces for power and ground connections.
  • Ensure good thermal conductivity by using a heat sink or a thermal pad on the exposed pad of the QFN package. Keep the junction temperature below 125°C. Use a thermal interface material with a thermal conductivity of at least 1 W/m-K.
  • Use a pi-filter (C-L-C) or a T-filter (L-C-L) configuration with a cutoff frequency of around 100 kHz to 1 MHz to filter out high-frequency noise and ensure stable operation.
  • Use a logic analyzer or an oscilloscope to monitor the digital signals. Check the power supply voltage, clock frequency, and signal integrity. Verify that the device is properly configured and that the firmware is up-to-date.
  • Use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or a ferrite bead to filter out high-frequency noise. Ensure that the device is properly grounded and that the power supply is decoupled.

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LTC2872CUHF#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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