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LTC2962CUD#PBF - Analog Devices

Description: ?0.5% Accurate Quad Configurable Supervisor

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PCB Footprints
LTC2962CUD#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UD Package 16-Lead Plastic QFN (3mm × 3mm) (Reference LTC DWG # 05-08-1691 Rev Ø)ss
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3D Models
LTC2962CUD#PBF - Analog Devices  - 3D model - Quad Flat No-Lead - UD Package 16-Lead Plastic QFN (3mm × 3mm) (Reference LTC DWG # 05-08-1691 Rev Ø)ss
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LTC2962CUD#PBF Details

  • Manufacturer Part Number:

    LTC2962CUD#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1691

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2018-08-02

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.25 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC2962CUD#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC2962CUD involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing the device close to the battery. A 4-layer board with a solid ground plane is recommended. Additionally, the device should be placed near the battery to minimize voltage drops and noise.
  • To optimize the performance of the LTC2962CUD in a high-temperature environment, ensure good thermal conduction by using a heat sink or a thermal pad, and keep the device away from heat sources. Also, consider using a thermistor to monitor the temperature and adjust the charging profile accordingly. Finally, ensure that the battery is rated for high-temperature operation.
  • No, the LTC2962CUD is designed specifically for rechargeable batteries and should not be used with non-rechargeable batteries. Using it with a non-rechargeable battery can cause damage to the device or the battery.
  • The LTC2962CUD has a built-in overvoltage protection feature that can be enabled by connecting the OV pin to a voltage source. The device will then limit the output voltage to the programmed value. Additionally, an external overvoltage protection circuit can be implemented using a voltage supervisor IC and a power switch.
  • The recommended input capacitor value for the LTC2962CUD is 10uF to 22uF, with a voltage rating of at least 25V. The capacitor should be placed close to the VIN pin and should have low ESR to minimize voltage drops and noise.

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LTC2962CUD#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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