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LTC2962HUD#TRPBF - Analog Devices

Description: ?0.5% Accurate Quad Configurable Supervisor16-Lead (3mm × 3mm) Plastic QFN –

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LTC2962HUD#TRPBF - Analog Devices - PCB symbol
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PCB Footprints
LTC2962HUD#TRPBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UD Package 16-Lead Plastic QFN (3mm × 3mm) (Reference LTC DWG # 05-08-1691 Rev Ø)ss
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3D Models
LTC2962HUD#TRPBF - Analog Devices - 3D model - Quad Flat No-Lead - UD Package 16-Lead Plastic QFN (3mm × 3mm) (Reference LTC DWG # 05-08-1691 Rev Ø)ss
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LTC2962HUD#TRPBF Details

  • Manufacturer Part Number:

    LTC2962HUD#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1738

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2018-08-02

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.25 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC2962HUD#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2962HUD involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer board with a dedicated power plane is recommended. Refer to the Analog Devices application note AN136 for more details.
  • To ensure accurate temperature measurement, make sure to calibrate the device, use a high-accuracy voltage reference, and minimize thermal gradients on the PCB. Also, consider using a thermocouple with a high-temperature rating and a low-thermal-mass design.
  • The maximum cable length for the thermocouple input of the LTC2962HUD depends on the type of thermocouple and the noise environment. As a general rule, keep the cable length as short as possible (less than 10 feet) and use twisted-pair or shielded cable to minimize noise pickup.
  • Yes, the LTC2962HUD can be used with non-standard thermocouple types, but you may need to adjust the cold-junction compensation and the thermocouple calibration. Consult the datasheet and application notes for more information on custom thermocouple configurations.
  • To handle EMI with the LTC2962HUD, use a shielded enclosure, keep the device away from high-frequency sources, and use EMI filters on the power supply and input lines. Also, consider using a common-mode choke on the thermocouple input lines.

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LTC2962HUD#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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