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LTC2966ISW#PBF - Analog Devices

Description: Supervisor Open Drain or Open Collector 2 Channel 20-SO, -40°C ~ 85°C

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LTC2966ISW#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - SW Package 20-Lead Plastic Small Outline (Wide .300 Inch)
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LTC2966ISW#PBF - Analog Devices  - 3D model - Small Outline Packages - SW Package 20-Lead Plastic Small Outline (Wide .300 Inch)
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LTC2966ISW#PBF Details

  • Manufacturer Part Number:

    LTC2966ISW#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    05-08-1620 (SW20)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Seated Height-Max:

    2.642 mm

  • Supply Voltage-Max (Vsup):

    100 V

  • Supply Voltage-Min (Vsup):

    3.5 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    7.493 mm

LTC2966ISW#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC2966ISW involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. A 4-layer PCB with a solid ground plane is recommended. The datasheet provides a recommended layout and placement diagram.
  • To optimize the performance of the LTC2966ISW, you should consider factors such as the input voltage range, output voltage range, and load current. You should also ensure that the device is operated within its recommended operating conditions. Additionally, you can use the device's adjustable soft-start feature to optimize the startup time and reduce inrush current.
  • The maximum ambient temperature range for the LTC2966ISW is -40°C to 125°C. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature should not exceed 150°C.
  • Yes, the LTC2966ISW is suitable for high-reliability and high-availability applications. It has a high MTBF (mean time between failures) rating and is designed to meet the requirements of high-reliability industries such as aerospace, defense, and medical devices.
  • To troubleshoot issues with the LTC2966ISW, you should first consult the datasheet and application notes to ensure that the device is being used correctly. You can also use a oscilloscope to measure the input and output voltages, and check for any signs of oscillation or instability. Additionally, you can use the device's built-in fault detection and protection features to identify and diagnose issues.

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LTC2966ISW#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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