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LTC3300HLXE-1#PBF - Analog Devices

Description: Battery Management Hi Eff Bi-dir Multicell Bat Balancer

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LTC3300HLXE-1#PBF - Analog Devices PCB footprint - Quad Flat Packages - Quad Flat Packages - 48-Lead Plastic Exposed Pad LQFP (7mm × 7mm)
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LTC3300HLXE-1#PBF - Analog Devices  - 3D model - Quad Flat Packages - 48-Lead Plastic Exposed Pad LQFP (7mm × 7mm)
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LTC3300HLXE-1#PBF Details

  • Manufacturer Part Number:

    LTC3300HLXE-1#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    05-08-1832

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    BATTERY MONITOR

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP32,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    5.3 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

LTC3300HLXE-1#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3300 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the input and output capacitors are of high quality and have low ESR. Also, avoid using long traces or wires for the feedback network, and keep the feedback resistors close to the device.
  • The LTC3300 is rated for operation from -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the device's power dissipation. It's essential to perform thermal analysis and ensure the device is within its thermal limits to ensure reliable operation.
  • Yes, the LTC3300 is available in a variety of grades, including the 'HL' grade, which is suitable for high-reliability applications. However, it's essential to consult with Analog Devices Inc and follow their guidelines for using the device in high-reliability or aerospace applications.
  • To troubleshoot issues with the LTC3300, start by verifying the input voltage, output voltage, and feedback network. Check for any signs of overheating, and ensure that the device is properly soldered and mounted. Use an oscilloscope to check for oscillations or noise on the output, and consult the datasheet and application notes for guidance on troubleshooting specific issues.

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LTC3300HLXE-1#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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