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LTC3407AIMSE-2#PBF - Analog Devices

Description: Dual Synchronous 800mA, 2.25MHz Step-Down DC/DC Regulator

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LTC3407AIMSE-2#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 10-Lead Plastic MSOP (Reference LTC DWG # 05-08-1664)-2025
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LTC3407AIMSE-2#PBF - Analog Devices  - 3D model - Small Outline Packages - MSE Package 10-Lead Plastic MSOP (Reference LTC DWG # 05-08-1664)-2025
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LTC3407AIMSE-2#PBF Details

  • Manufacturer Part Number:

    LTC3407AIMSE-2#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1664

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    DUAL SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    CONSTANT FREQUENCY

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.5 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.6 A

  • Output Voltage-Max:

    5 V

  • Output Voltage-Min:

    0.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.95 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2700 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC3407AIMSE-2#PBF Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the LTC3407AIMSE-2#PBF is 15V, but it's recommended to keep it below 12V for optimal performance and reliability.
  • The LTC3407AIMSE-2#PBF is rated for operation up to 125°C, but it's recommended to derate the output current and input voltage at high temperatures to ensure reliability and prevent thermal shutdown.
  • To ensure the stability of the output voltage, make sure to follow the recommended layout guidelines, use a sufficient output capacitor, and avoid high-ESR capacitors. Additionally, consider adding a small ceramic capacitor in parallel with the output capacitor to improve transient response.
  • Yes, the LTC3407AIMSE-2#PBF is suitable for battery-powered devices due to its low quiescent current and high efficiency. However, consider adding undervoltage lockout (UVLO) and overvoltage protection (OVP) to prevent damage from battery voltage fluctuations.
  • The output voltage ripple of the LTC3407AIMSE-2#PBF can be calculated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency.

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LTC3407AIMSE-2#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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