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LTC3670EDDB#TRMPBF - Analog Devices

Description: Monolithic 400mA Buck Regulator with Dual 150mA LDOs in 3mm × 2mm DFN

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LTC3670EDDB#TRMPBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - DDB Package 12-Lead Plastic DFN (3mm × 2mm)
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LTC3670EDDB#TRMPBF - Analog Devices  - 3D model - Small Outline No-lead - DDB Package 12-Lead Plastic DFN (3mm × 2mm)
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LTC3670EDDB#TRMPBF Details

  • Manufacturer Part Number:

    LTC3670EDDB#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    3 X 2 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, DFN-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    05-08-1723

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    BURST MODE

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.5 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PDSO-N12

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.1 A

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2590 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.45 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

LTC3670EDDB#TRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3670EDDB involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the high-current paths. A 4-layer PCB with a dedicated power plane is recommended.
  • The compensation network for the LTC3670EDDB involves selecting the right values for the compensation resistors and capacitors. A good starting point is to use the values recommended in the datasheet, and then adjust them based on the specific application and desired performance.
  • The maximum ambient temperature for the LTC3670EDDB is 85°C, but it can be derated for higher temperatures. It's essential to ensure good airflow and heat sinking to prevent overheating.
  • Yes, the LTC3670EDDB is suitable for high-reliability applications. It's manufactured using a robust process, and Analog Devices provides a high level of quality and reliability testing. However, it's essential to follow proper design and manufacturing practices to ensure the highest reliability.
  • To troubleshoot issues with the LTC3670EDDB, start by checking the input voltage, output voltage, and current. Verify that the input and output capacitors are properly connected and that the compensation network is correct. Use an oscilloscope to check for oscillations or other anomalies.

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LTC3670EDDB#TRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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