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LTC3677EUFF-3#PBF - Analog Devices

Description: Battery Management Hily Int Portable Product PMIC

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LTC3677EUFF-3#PBF - Analog Devices PCB footprint - Other - Other - LTC3677EUFF-3#PBF-4
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LTC3677EUFF-3#PBF - Analog Devices  - 3D model - Other - LTC3677EUFF-3#PBF-4
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LTC3677EUFF-3#PBF Details

  • Manufacturer Part Number:

    LTC3677EUFF-3#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    7 X 4 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, QFN-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    05-08-1762

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    R-PQCC-N44

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC44,.16X.28,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

LTC3677EUFF-3#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3677EUFF-3#PBF involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce EMI and noise. A 4-layer PCB with a dedicated power plane is recommended.
  • To ensure the LTC3677EUFF-3#PBF operates within its specified temperature range, provide adequate heat sinking, avoid overheating, and keep the device away from high-temperature sources. Also, consider using thermal interface materials and heat sinks with a thermal resistance of less than 10°C/W.
  • Not using the recommended input and output capacitors with the LTC3677EUFF-3#PBF can lead to reduced efficiency, increased output voltage ripple, and decreased stability. It may also cause the device to oscillate or become unstable, leading to reduced performance and reliability.
  • To troubleshoot issues with the LTC3677EUFF-3#PBF, start by checking the input voltage, output voltage, and current. Verify that the device is properly configured and that the input and output capacitors are correctly sized and connected. Use an oscilloscope to check for oscillations or noise on the output. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, the LTC3677EUFF-3#PBF is suitable for high-reliability and safety-critical applications. However, it is essential to follow proper design and testing procedures to ensure the device meets the required safety and reliability standards. Consult the datasheet and relevant industry standards for guidance on designing and testing high-reliability and safety-critical systems.

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LTC3677EUFF-3#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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