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LTC3834EGN-1#PBF - Analog Devices

Description: 30μA IQ Synchronous Step-Down Controller

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LTC3834EGN-1#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow .150 Inch)
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LTC3834EGN-1#PBF - Analog Devices - 3D model - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow .150 Inch)
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LTC3834EGN-1#PBF Details

  • Manufacturer Part Number:

    LTC3834EGN-1#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    4 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.8895 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    650 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.899 mm

LTC3834EGN-1#PBF Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the LTC3834EGN-1#PBF involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it is recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to reduce noise and improve thermal performance.
  • The selection of input and output capacitors for the LTC3834EGN-1#PBF depends on the specific application requirements. In general, it is recommended to use low-ESR capacitors with a high ripple current rating. The input capacitor should be able to handle the input voltage and current, while the output capacitor should be able to handle the output voltage and current. A good starting point is to use capacitors with a capacitance value of 10uF to 22uF and a voltage rating of 1.5 to 2 times the input voltage.
  • The maximum ambient temperature that the LTC3834EGN-1#PBF can operate in is 85°C. However, the device can operate at higher temperatures with derating. It is recommended to consult the datasheet and the thermal derating curves to determine the maximum operating temperature for a specific application.
  • To troubleshoot issues with the LTC3834EGN-1#PBF, it is recommended to follow a systematic approach. First, verify that the device is properly connected and that the input and output capacitors are correctly sized. Next, check the input and output voltage levels and ensure that they are within the recommended operating range. If the issue persists, use an oscilloscope to check for oscillation or instability, and consult the datasheet and application notes for guidance on troubleshooting and debugging.
  • Yes, the LTC3834EGN-1#PBF can be used in high-reliability or high-availability applications. The device is designed to meet the requirements of high-reliability applications, with features such as overvoltage protection, undervoltage lockout, and short-circuit protection. Additionally, the device is manufactured using a high-reliability process and is screened to ensure high reliability and low defect rates.

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LTC3834EGN-1#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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