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LTC4070EMS8E#PBF - Analog Devices

Description: Battery Charger Li-Ion/Li-Pol 50mA 4.2V Automotive 8-Pin MSOP EP Tube

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LTC4070EMS8E#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad_1
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LTC4070EMS8E#PBF - Analog Devices  - 3D model - Small Outline Packages - MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad_1
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LTC4070EMS8E#PBF Details

  • Manufacturer Part Number:

    LTC4070EMS8E#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1662

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Nom (Vsup):

    3.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC4070EMS8E#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC4070 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce EMI and noise. A 4-layer board with a dedicated power plane and a solid ground plane is recommended.
  • The input capacitor should be a low-ESR ceramic capacitor with a value of at least 10uF, and the output capacitor should be a low-ESR ceramic or tantalum capacitor with a value of at least 22uF. The capacitor values and types should be chosen based on the specific application requirements and operating conditions.
  • The LTC4070 is rated for operation from -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the device's power dissipation. It's recommended to derate the device's power dissipation based on the ambient temperature to ensure reliable operation.
  • The LTC4070 is rated for a maximum input voltage of 18V, but it can be used in high-voltage applications with the use of an external voltage regulator or a voltage divider to reduce the input voltage to within the device's rating. However, this requires careful design and consideration of the device's power dissipation and thermal management.
  • Troubleshooting issues with the LTC4070 involves checking the PCB layout, component values, and soldering quality. It's also recommended to use a scope to measure the input and output voltages, and to check for any signs of oscillation or instability. The device's datasheet and application notes provide guidance on troubleshooting and debugging techniques.

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LTC4070EMS8E#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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