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LTC4442EMS8E#PBF - Analog Devices

Description: Driver 5A 2-OUT High and Low Side Inv/Non-Inv 8-Pin MSOP EP Tube

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LTC4442EMS8E#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad
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LTC4442EMS8E#PBF - Analog Devices  - 3D model - Small Outline Packages - MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad
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LTC4442EMS8E#PBF Details

  • Manufacturer Part Number:

    LTC4442EMS8E#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1662

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    IT CAN ALSO OPERATE WITH 5V

  • High Side Driver:

    YES

  • Input Characteristics:

    GATED

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    2.4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.85 mA

  • Supply Voltage-Max:

    9.5 V

  • Supply Voltage-Min:

    6 V

  • Supply Voltage-Nom:

    7 V

  • Supply Voltage1-Max:

    42 V

  • Supply Voltage1-Min:

    5 V

  • Supply Voltage1-Nom:

    7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.012 µs

  • Turn-on Time:

    0.02 µs

  • Width:

    3 mm

LTC4442EMS8E#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC4442EMS8E#PBF involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper biasing, make sure to connect the VCC pin to a stable voltage source, and the GND pin to a solid ground plane. Also, ensure that the input voltage is within the recommended range of 2.7V to 5.5V, and that the output voltage is properly terminated.
  • The maximum operating frequency of the LTC4442EMS8E#PBF is 100 MHz. However, the actual operating frequency may be limited by the specific application and the quality of the PCB layout.
  • To handle thermal management, ensure good airflow around the device, and consider using a heat sink or thermal pad if the device is expected to operate at high temperatures or high power levels. The maximum junction temperature of the LTC4442EMS8E#PBF is 150°C.
  • The recommended input impedance for the LTC4442EMS8E#PBF is 50 ohms. This ensures optimal signal integrity and minimizes reflections.

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LTC4442EMS8E#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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