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LTC5597IDC#TRPBF - Analog Devices

Description: 100MHz to 70GHz Linear-in-dB RMS Power Detector with 35dB Dynamic Range

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PCB Footprints
LTC5597IDC#TRPBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - DC Package 8-Lead Plastic DFN (2mm × 2mm), Flip Chip_2026-1.15
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3D Models
LTC5597IDC#TRPBF - Analog Devices  - 3D model - Small Outline No-lead - DC Package 8-Lead Plastic DFN (2mm × 2mm), Flip Chip_2026-1.15
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LTC5597IDC#TRPBF Details

  • Manufacturer Part Number:

    LTC5597IDC#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1957

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2020-06-11

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    POWER SUPPLY SUPPORT CIRCUIT

  • JESD-30 Code:

    S-PDSO-N8

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    37.3 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

LTC5597IDC#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC5597IDC#TRPBF involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended. Refer to the application note AN137 for more details.
  • The LTC5597IDC#TRPBF requires a single 3.3V or 5V power supply. Ensure that the power supply is clean and well-regulated. The device has an internal power-on reset circuit, so no external reset circuit is required. However, it's recommended to add a 10kΩ pull-up resistor on the EN pin to ensure proper enablement.
  • The LTC5597IDC#TRPBF can support data rates up to 6.4Gbps. However, the actual data rate achievable depends on the specific application, PCB layout, and signal integrity. It's recommended to perform signal integrity analysis and simulation to ensure reliable data transmission.
  • To troubleshoot issues with the LTC5597IDC#TRPBF, use a combination of tools such as oscilloscopes, logic analyzers, and signal integrity software. Check the device's output signal quality, clock signal integrity, and data transmission errors. Refer to the device's datasheet and application notes for troubleshooting guidelines and tips.
  • The LTC5597IDC#TRPBF has a maximum junction temperature of 150°C. To ensure reliable operation, keep the device's junction temperature below 125°C. Use thermal vias, thermal pads, and heat sinks as needed to dissipate heat. Refer to the device's datasheet and thermal management application notes for more information.

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LTC5597IDC#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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