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LTC6252IS6#TRPBF - Analog Devices

Description: 720MHz, 3.5mA Power Efficient Rail-to-Rail I/O Op Amps

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PCB Footprints
LTC6252IS6#TRPBF - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - S6 Package 6-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1636)
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3D Models
LTC6252IS6#TRPBF - Analog Devices  - 3D model - SOT23 (6-Pin) - S6 Package 6-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1636)
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LTC6252IS6#TRPBF Details

  • Manufacturer Part Number:

    LTC6252IS6#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LEAD FREE, PLASTIC, MO-193, TSOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    05-08-1636

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.7 µA

  • Bias Current-Max (IIB) @25C:

    2.5 µA

  • Common-mode Reject Ratio-Min:

    77 dB

  • Common-mode Reject Ratio-Nom:

    105 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1400 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Slew Rate-Nom:

    170 V/us

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    630000

  • Voltage Gain-Min:

    1800

  • Wideband:

    YES

  • Width:

    1.625 mm

LTC6252IS6#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6252IS6 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the IC. A 4-layer PCB with a dedicated ground plane is recommended.
  • To optimize the performance of the LTC6252IS6 in a high-frequency application, use a low-ESR input capacitor, minimize the input and output trace lengths, and use a high-frequency-compatible PCB material. Additionally, consider using a ferrite bead or a common-mode choke to filter out high-frequency noise.
  • The maximum power dissipation of the LTC6252IS6 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated based on the actual operating conditions.
  • The LTC6252IS6 is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the device's power dissipation and consider using a heat sink or a thermally-enhanced package for high-temperature applications.
  • To troubleshoot oscillations or instability issues with the LTC6252IS6, check the PCB layout for any signs of resonance or noise coupling. Verify that the input and output capacitors are properly selected and placed. Also, ensure that the device is properly bypassed and decoupled. If the issue persists, consider using a simulation tool or consulting with an Analog Devices application engineer.

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LTC6252IS6#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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