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LTC6253ITS8#TRPBF - Analog Devices

Description: 720MHz, 3.5mA Dual Power Efficient Rail-to-Rail I/O Op Amps

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PCB Footprints
LTC6253ITS8#TRPBF - Analog Devices PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - TS8 Package 8-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1637 Rev A)
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3D Models
LTC6253ITS8#TRPBF - Analog Devices  - 3D model - SOT23 (8-Pin) - TS8 Package 8-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1637 Rev A)
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LTC6253ITS8#TRPBF Details

  • Manufacturer Part Number:

    LTC6253ITS8#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LEAD FREE, PLASTIC, MO-193, TSOT-23, 8 PIN

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1637

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.7 µA

  • Bias Current-Max (IIB) @25C:

    2.5 µA

  • Common-mode Reject Ratio-Min:

    77 dB

  • Common-mode Reject Ratio-Nom:

    105 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1400 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Slew Rate-Nom:

    170 V/us

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    630000

  • Voltage Gain-Min:

    1800

  • Wideband:

    YES

  • Width:

    1.625 mm

LTC6253ITS8#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6253 involves keeping the input and output traces short and separate, using a solid ground plane, and placing the bypass capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, the datasheet provides a recommended PCB layout and land pattern that should be followed.
  • To ensure stability, it's essential to follow the recommended compensation network and component values provided in the datasheet. Additionally, the input and output capacitors should be selected based on the specific application requirements, and the device should be operated within its recommended operating conditions. A stability analysis using simulation tools or SPICE models can also be performed to verify the design.
  • The maximum power dissipation of the LTC6253 is dependent on the package type and the ambient temperature. For the ITS8 package, the maximum power dissipation is approximately 1.4W at 25°C ambient temperature. The power dissipation can be calculated using the formula: Pd = (VIN - VOUT) x IOUT + (VIN x IQ), where IQ is the quiescent current. It's essential to ensure that the device is operated within its recommended power dissipation limits to prevent overheating and ensure reliability.
  • The LTC6253 is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. The datasheet provides temperature-related specifications and limitations, such as reduced output current and increased quiescent current at high temperatures. It's essential to evaluate the device's performance and reliability in the specific application environment and ensure that it meets the required specifications.
  • The input and output capacitors should be selected based on the specific application requirements, such as the input voltage range, output voltage, and ripple current. The datasheet provides guidelines for selecting the input and output capacitors, including the recommended capacitance values, ESR, and voltage ratings. Additionally, the capacitors should be placed close to the device to minimize parasitic inductance and ensure optimal performance.

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LTC6253ITS8#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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