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LTC6400IUD-20#PBF - Analog Devices

Description: High Speed Operational Amplifiers 3GHz Low Noise/Low Distortion Differential Amp

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LTC6400IUD-20#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UD Package 16-Lead Plastic QFN (3mm × 3mm)_2022
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3D Models
LTC6400IUD-20#PBF - Analog Devices  - 3D model - Quad Flat No-Lead - UD Package 16-Lead Plastic QFN (3mm × 3mm)_2022
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LTC6400IUD-20#PBF Details

  • Manufacturer Part Number:

    LTC6400IUD-20#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1691

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Common-mode Reject Ratio-Nom:

    65 dB

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Nom:

    0.0045 V/us

  • Supply Voltage Limit-Max:

    3.6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC6400IUD-20#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6400IUD-20 involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing the device close to the analog power supply. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, a small series resistor (e.g., 10Ω) can be added to the output to improve stability.
  • The maximum power dissipation of the LTC6400IUD-20 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this can be derated to 0.7W at 85°C ambient temperature.
  • The LTC6400IUD-20 is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the power dissipation and ensure proper thermal management to ensure reliable operation in high-temperature environments.
  • To troubleshoot issues with the LTC6400IUD-20, start by verifying the power supply voltage and ensuring that it's within the recommended range. Check the input and output signals using an oscilloscope to identify any anomalies. Also, ensure that the PCB layout and component values are correct. If the issue persists, consult the datasheet and application notes for guidance.

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LTC6400IUD-20#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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