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LTC6810IG-2#3ZZPBF - Analog Devices

Description: 6 Channel Multicell Battery Monitor with Addressable Interface, Generation 4

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LTC6810IG-2#3ZZPBF - Analog Devices - PCB symbol
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PCB Footprints
LTC6810IG-2#3ZZPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - G Package 44-Lead Plastic SSOP (5.3mm) (Reference LTC DWG # 05-08-1754 Rev A)_2021
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3D Models
LTC6810IG-2#3ZZPBF - Analog Devices - 3D model - Small Outline Packages - G Package 44-Lead Plastic SSOP (5.3mm) (Reference LTC DWG # 05-08-1754 Rev A)_2021
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LTC6810IG-2#3ZZPBF Details

  • Manufacturer Part Number:

    LTC6810IG-2#3ZZPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    05-08-1754

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    BATTERY MONITOR

  • JESD-30 Code:

    R-PDSO-G44

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max (Vsup):

    27.5 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    20 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    5.3 mm

LTC6810IG-2#3ZZPBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and separate analog and digital power planes is recommended. Keep sensitive analog traces away from digital traces and ensure good decoupling and bypassing.
  • Calibration involves writing specific values to the device's registers. Refer to the datasheet's calibration procedure and use the provided software tools or a custom script to perform the calibration.
  • Up to 12 devices can be daisy-chained together using the SPI interface, allowing for the monitoring of up to 384 cells.
  • Use proper shielding, filtering, and grounding techniques. Add ferrite beads or common-mode chokes to the power and signal lines, and consider using a shielded enclosure.
  • Power up the device in the following sequence: VCC, VIO, and then the clock signal. Ensure that the power supplies are stable and within the recommended voltage range.

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LTC6810IG-2#3ZZPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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