LTC7860IMSE#TRPBF footprint, schematic symbol and 3D model by Analog Devices

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Part Number LTC7860IMSE#TRPBF
Manufacturer Analog Devices
Pin Count 13
Part Category Integrated Circuit
Package Category Small Outline Packages
Footprint Name Small Outline Packages - 12-Lead Plastic MSOP, Exposed Die Pad-
Released Date Jul 26, 2026
Last Modified Date Jul 26, 2026 6:52 AM UTC
Pinout / Pin List Click Here (Member Only)

LTC7860IMSE#TRPBF Details

Manufacturer Part Number:
LTC7860IMSE#TRPBF
Brand Name:
Analog Devices Inc
Pbfree Code:
No
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
MSOP-12
Pin Count:
12
Manufacturer Package Code:
05-08-1666
Country Of Origin:
Malaysia
ECCN Code:
EAR99
HTS Code:
8542.39.00.01
Manufacturer:
Analog Devices Inc
YTEOL:
9
Adjustable Threshold:
YES
Analog IC - Other Type:
INPUT FAULT PROTECTION CONTROLLER
JESD-30 Code:
R-PDSO-G12
JESD-609 Code:
e3
Length:
4.039 mm
Moisture Sensitivity Level:
1
Number of Channels:
1
Number of Functions:
1
Number of Terminals:
12
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
HTSSOP
Package Equivalence Code:
TSSOP12,.19
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
1.1 mm
Supply Voltage-Max (Vsup):
60 V
Supply Voltage-Min (Vsup):
3.5 V
Supply Voltage-Nom (Vsup):
12 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Width:
3 mm

LTC7860IMSE#TRPBF Frequently Asked Questions (FAQs)

A good PCB layout for the LTC7860IMSE involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended. Additionally, it's essential to follow the datasheet's guidelines for thermal pad connection and heat sink attachment.
To optimize the performance of the LTC7860IMSE, it's essential to carefully select the input and output capacitors, choose the right inductor value, and set the switching frequency according to the application requirements. Additionally, optimizing the PCB layout, using a low-ESR output capacitor, and minimizing the input voltage ripple can also improve the device's performance.
The LTC7860IMSE has a thermal pad that must be connected to a heat sink or a solid ground plane to ensure proper heat dissipation. The device's junction temperature (TJ) should be kept below 125°C to ensure reliable operation. A thermal interface material (TIM) can be used to improve the thermal connection between the device and the heat sink.
To troubleshoot issues with the LTC7860IMSE, start by checking the input voltage, output voltage, and switching frequency. Verify that the device is properly configured and that the input and output capacitors are correctly selected. Use an oscilloscope to check for voltage ripple, ringing, or oscillations. Check the PCB layout for any errors or omissions, and ensure that the device is properly soldered and connected.
The LTC7860IMSE is a switching regulator that can generate electromagnetic interference (EMI). To minimize EMI, use a shielded inductor, keep the input and output traces short and away from sensitive circuits, and use a common-mode choke or EMI filter at the input. Additionally, ensure that the PCB layout is designed to minimize radiation and that the device is properly shielded.

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LTC7860IMSE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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