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LTM8032IY#PBF - Analog Devices

Description: Switching Voltage Regulators EN55022B Compliant 36V, 2A DC/DC uModul

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PCB Footprints
LTM8032IY#PBF - Analog Devices PCB footprint - BGA - BGA - BGA Package 71-Lead (15mm × 9.00mm × 3.42mm)_2024
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3D Models
LTM8032IY#PBF - Analog Devices  - 3D model - BGA - BGA Package 71-Lead (15mm × 9.00mm × 3.42mm)_2024
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LTM8032IY#PBF Details

  • Manufacturer Part Number:

    LTM8032IY#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    9 X 15 MM, 3.42 MM HEIGHT, ROHS COMPLIANT, MS-028, BGA-71

  • Pin Count:

    71

  • Manufacturer Package Code:

    05-08-1885

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 0.8V TO 10V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    3.6 V

  • Input Voltage-Nom:

    10 V

  • JESD-30 Code:

    R-PBGA-B71

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    71

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Max:

    10 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA71,7X11,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.62 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2400 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

LTM8032IY#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTM8032IY#PBF should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A 4-layer board with a dedicated thermal layer is recommended.
  • To ensure reliable start-up and shutdown, make sure to follow the recommended power-up and power-down sequences outlined in the datasheet. Additionally, add a soft-start circuit to limit the inrush current and prevent voltage overshoots.
  • When selecting output capacitors, consider the capacitance value, equivalent series resistance (ESR), and voltage rating. Choose capacitors with low ESR and high ripple current ratings to minimize voltage ripple and ensure stable operation.
  • To optimize the LTM8032IY#PBF for low noise and high power supply rejection ratio (PSRR), use a low-noise input voltage, add a noise filter at the input, and ensure good PCB layout practices, such as separating analog and digital grounds.
  • For high-power applications, ensure good thermal contact between the device and the heat sink, and use a heat sink with a high thermal conductivity. Also, consider using a thermal interface material to fill any gaps between the device and heat sink.

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LTM8032IY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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