Please enter a minimum 3 letters or numbers
Technical Content
Part Image

LV8417CS-TE-L-H - onsemi

Description: Motor / Motion / Ignition Controllers & Drivers 1-ch H-bridge Step Motor Driver IC

Download LV8417CS-TE-L-H Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
LV8417CS-TE-L-H - onsemi - PCB symbol
click to zoom
PCB Footprints
LV8417CS-TE-L-H - onsemi PCB footprint - BGA - BGA - wlp9(1.47*1.47)
click to zoom
3D Models
LV8417CS-TE-L-H - onsemi - 3D model - BGA - wlp9(1.47*1.47)
click to zoom

LV8417CS-TE-L-H Details

  • Manufacturer Part Number:

    LV8417CS-TE-L-H

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Pin Count:

    9

  • Manufacturer Package Code:

    567FM

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B9

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA9,3X3,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Current-Max (Isup):

    0.8 mA

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

LV8417CS-TE-L-H Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency circuits, and ensure proper grounding and decoupling. Follow onsemi's EMI/RFI guidelines for the LV8417CS-TE-L-H.
  • Yes, the LV8417CS-TE-L-H is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that you follow the recommended design and testing guidelines for these applications.
  • Use a thermal imaging camera to identify hotspots, check for proper PCB layout and thermal design, and verify that the device is operated within its recommended specifications. Consult onsemi's application notes and technical support for further assistance.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

LV8417CS-TE-L-H Overview

Use the download button to access the LV8417CS-TE-L-H schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LV841, or try a keyword search, such as Motion Control Electronics

Suggested Parts

If you searched for LV8417CS-TE-L-H, you might also be interested in these parts:
Part Number
885012207090
UMD5NTR
BAS40-04W
865080545012
74HC132D,653
LM2876T
LM385PWR-1-2
SMDR0805CTC1351N
SMDR1206CTC1351N

Parts related to LV8417CS-TE-L-H

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑