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LV8824QA-NH - onsemi

Description: Motor / Motion / Ignition Controllers & Drivers 3PHASE MOTOR PRE-DRIVER

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PCB Footprints
LV8824QA-NH - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - VQFN32U(5.0X5.0)
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3D Models
LV8824QA-NH - onsemi  - 3D model - Quad Flat No-Lead - VQFN32U(5.0X5.0)
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LV8824QA-NH Details

  • Manufacturer Part Number:

    LV8824QA-NH

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VQFN-32

  • Manufacturer Package Code:

    510AZ

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    1-PHASE BRUSHLESS DC MOTOR CONTROLLER

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.05 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    6 mA

  • Supply Voltage-Max (Vsup):

    33 V

  • Supply Voltage-Min (Vsup):

    7 V

  • Supply Voltage-Nom (Vsup):

    24 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

LV8824QA-NH Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer.
  • The critical timing parameters include the input rise and fall times, output delay, and propagation delay. These parameters are typically specified in the datasheet, but may require additional consideration for specific applications.
  • Use proper PCB layout techniques, such as separating analog and digital circuits, using shielding, and minimizing loop areas. Additionally, consider using EMI filters or common-mode chokes to reduce emissions.
  • Typically, 0.1uF to 1uF ceramic capacitors are recommended, placed as close to the device as possible. The capacitor values and placement may vary depending on the specific application and PCB layout.

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LV8824QA-NH Overview

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