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M0G3107QRHBRQ1 - Texas Instruments

Description: • Core – Arm® 32-bit Cortex®-M0+ CPU with memory protection unit, frequency up to 80MHz • Functional Safety Quality-Managed – Functional Safety Manual and FMEDA available to aid in functional safety system design • Operating characteristics – Extended temperature: –40°C up to 125°C – Wide supply voltage range: 1.62V to 3.6V • Memories – Up to 128KB of flash memory with built-in error correction code (ECC) – Up to 32KB of SRAM with hardware parity • High-performance analog peripherals – Two si

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M0G3107QRHBRQ1 - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - VQFN
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M0G3107QRHBRQ1 Details

  • Manufacturer Part Number:

    M0G3107QRHBRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of DMA Channels:

    7

  • Number of I/O Lines:

    28

  • Number of Serial I/Os:

    5

  • Number of Terminals:

    32

  • Number of Timers:

    7

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    32768

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Speed:

    80 MHz

  • Supply Current-Max:

    80 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

M0G3107QRHBRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the device. Additionally, ensure that the power and ground pins are connected to a low-impedance source.
  • The M0G3107QRHBRQ1 has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow around the device.
  • The recommended power-up sequence is to apply VCC first, followed by VIO, and then the clock signal. This ensures that the internal voltage regulators are properly initialized and the device is configured correctly.
  • To configure the M0G3107QRHBRQ1 for low-power operation, use the Power Management Interface (PMI) to control the power modes. The device has multiple power modes, including sleep, deep sleep, and shutdown. Use the PMI to select the desired power mode and adjust the clock frequency and voltage levels accordingly.
  • To minimize EMI and ensure EMC, follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the device. Use shielding and filtering components as necessary, and ensure that the device is properly decoupled from the power supply.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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