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M0L1306QDGS20RQ1 - Texas Instruments

Description: ARM® Cortex®-M0+ MSPM0 L Microcontroller IC 32-Bit 32MHz 64KB (64K x 8) FLASH 20-VSSOP

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M0L1306QDGS20RQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0020A_2025-1
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M0L1306QDGS20RQ1 - Texas Instruments  - 3D model - Small Outline Packages - DGS0020A_2025-1
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M0L1306QDGS20RQ1 Details

  • Manufacturer Part Number:

    M0L1306QDGS20RQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    Cortex-M0+

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    5.1 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    28

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    20

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    4096

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

M0L1306QDGS20RQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a thermal pad on the bottom of the package, connected to a copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal plane.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the specified operating range of 1.8V to 5V.
  • The M0L1306QDGS20RQ1 is an industrial-grade device, but it's not specifically designed for high-reliability or automotive applications. For such applications, consider using devices with a higher qualification level, such as AEC-Q100 or MIL-STD-883.
  • The M0L1306QDGS20RQ1 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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