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M0L1306QDGS32RQ1 - Texas Instruments

Description: ARM Microcontrollers - MCU Automotive 32-Mhz Ar m Cortex-M0+ with 64

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M0L1306QDGS32RQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0032A_2025-1.1
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M0L1306QDGS32RQ1 - Texas Instruments  - 3D model - Small Outline Packages - DGS0032A_2025-1.1
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M0L1306QDGS32RQ1 Details

  • Manufacturer Part Number:

    M0L1306QDGS32RQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    Cortex-M0+

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e4

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    28

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    32

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    4096

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Speed:

    32 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

M0L1306QDGS32RQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to note that a solid ground plane, wide traces, and minimal thermal vias can help reduce thermal resistance and improve overall performance.
  • To ensure reliable operation at high temperatures, it's crucial to follow the recommended operating conditions, use a suitable thermal interface material, and consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • The 'Q' suffix in the part number indicates that the device is automotive-qualified, meeting the AEC-Q100 standard for automotive applications. This implies that the device has undergone additional testing and qualification to ensure reliability and performance in harsh automotive environments.
  • Yes, the M0L1306QDGS32RQ1 can be used in non-automotive applications, but it's essential to ensure that the device's operating conditions, including temperature and power dissipation, are within the recommended specifications.
  • The 'RQ1' and 'RQ2' packages differ in their pinout and package dimensions. The 'RQ1' package has a smaller footprint and is suitable for more compact designs, while the 'RQ2' package has a larger footprint and is more suitable for applications requiring easier assembly and inspection.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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