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M2GL005-FGG484 - Microchip

Description: FPGA - Field Programmable Gate Array M2GL005-FGG484

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M2GL005-FGG484 - Microchip - PCB symbol
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PCB Footprints
M2GL005-FGG484 - Microchip PCB footprint - BGA - BGA - FG484_2023
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3D Models
M2GL005-FGG484 - Microchip - 3D model - BGA - FG484_2023
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M2GL005-FGG484 Details

  • Manufacturer Part Number:

    M2GL005-FGG484

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA, BGA484,22X22,40

  • Pin Count:

    484

  • Manufacturer Package Code:

    PBGA-484

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand, USA

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    24

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    209

  • Number of Logic Cells:

    6060

  • Number of Outputs:

    209

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    65 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

M2GL005-FGG484 Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout guide in their application note AN1571, which includes guidelines for signal integrity, power distribution, and thermal management.
  • The M2GL005-FGG484 has a flexible clocking system. Refer to the Microchip Clocking and PLL User's Guide (DS60001184) for guidance on configuring the clock domains, PLLs, and clock sources for your specific application.
  • The internal oscillator has a limited frequency range and accuracy. If your application requires a higher frequency or better accuracy, use an external oscillator. Consult the datasheet and application notes for guidance on oscillator selection and configuration.
  • Microchip provides a Secure Boot and Secure Firmware Update solution through their TrustPlatform and CryptoAuthLib libraries. Refer to the Microchip TrustPlatform User's Guide (DS60001185) and CryptoAuthLib API documentation for implementation details.
  • The power consumption and thermal characteristics of the M2GL005-FGG484 depend on the operating frequency, voltage, and application. Consult the datasheet and Microchip's Power Estimation and Thermal Management application note (AN1572) for guidance on power and thermal management.

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M2GL005-FGG484 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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