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M2GL050TS-1FG484M - Microchip

Description: FPGA IGLOO®2 Family 56340 Cells 1.2V 484-Pin FBGA Tray

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M2GL050TS-1FG484M - Microchip - PCB symbol
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PCB Footprints
M2GL050TS-1FG484M - Microchip PCB footprint - BGA - BGA - FG484—Fully Populated MS-034 VAR AAJ-1, Larger Mold Cap Size
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3D Models
M2GL050TS-1FG484M - Microchip - 3D model - BGA - FG484—Fully Populated MS-034 VAR AAJ-1, Larger Mold Cap Size
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M2GL050TS-1FG484M Details

  • Manufacturer Part Number:

    M2GL050TS-1FG484M

  • Part Life Cycle Code:

    Active

  • Package Description:

    FPBGA-484

  • Pin Count:

    484

  • Manufacturer Package Code:

    PBGA-484

  • Country Of Origin:

    South Korea

  • ECCN Code:

    3A001.a.2.c

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e0

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    267

  • Number of Outputs:

    267

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    65 nm

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

M2GL050TS-1FG484M Frequently Asked Questions (FAQs)

  • Microchip provides a reference design guide for the M2GL050TS-1FG484M, which includes recommended PCB layout guidelines for optimal performance, thermal management, and signal integrity.
  • The M2GL050TS-1FG484M has a built-in POR circuit, but it's recommended to use an external POR circuit to ensure reliable operation. Microchip provides application notes and design guides for implementing a reliable POR circuit.
  • The M2GL050TS-1FG484M has a thermal junction-to-case rating of 2°C/W. To ensure reliable operation, it's essential to follow proper thermal management practices, such as using a heat sink, thermal interface material, and ensuring good airflow.
  • To optimize the M2GL050TS-1FG484M for low power consumption, use the power-saving features such as clock gating, dynamic voltage and frequency scaling, and shutdown modes. Additionally, optimize the system design to minimize power consumption, and use low-power peripherals and interfaces.
  • To minimize EMI and ensure EMC, follow proper PCB layout guidelines, use shielding, and implement filtering and decoupling techniques. Microchip provides application notes and design guides for EMI and EMC considerations.

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M2GL050TS-1FG484M Overview

Use the download button to access the M2GL050TS-1FG484M schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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M2GL050TS-1FG484M Alternates

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Part Image M2GL050TS-1FG484M Microsemi Corporation (now Microchip)

Field Programmable Gate Array, 56340-Cell, CMOS, PBGA484