Part Image

M2GL060-FGG676I - Microchip

Description: FPGA - Field Programmable Gate Array IGLOO2 Low Density FPGA, 56.5KLEs

Download M2GL060-FGG676I Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
M2GL060-FGG676I - Microchip PCB footprint - BGA - BGA - FG676
click to zoom
3D Models
M2GL060-FGG676I - Microchip  - 3D model - BGA - FG676
click to zoom

M2GL060-FGG676I Details

  • Manufacturer Part Number:

    M2GL060-FGG676I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA, BGA676,26X26,40

  • Pin Count:

    676

  • Manufacturer Package Code:

    PBGA-676

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand, USA

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    24

  • JESD-30 Code:

    S-PBGA-B676

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    387

  • Number of Outputs:

    387

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    65 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

M2GL060-FGG676I Frequently Asked Questions (FAQs)

  • Microchip provides a PCB design guide for the M2GL060-FGG676I, which recommends a 4-layer PCB stackup with a solid ground plane, and suggests using differential pairs for clock and high-speed signals. Additionally, it's recommended to keep signal traces short and away from noise sources.
  • A POR circuit can be implemented using a voltage supervisor IC, such as the Microchip MCP112-315JE/OT, which can detect the power supply voltage and generate a reset signal to the FPGA. The POR circuit should be designed to ensure a clean and reliable reset signal to the FPGA during power-up.
  • Best practices for clock management include using the FPGA's built-in clock management resources, such as the clock generator and clock distribution network, to minimize clock skew and jitter. It's also recommended to use a single clock domain for the entire design, and to use clock enables and clock gating to reduce power consumption.
  • To optimize power consumption, use clock gating, power gating, and dynamic voltage and frequency scaling. Additionally, use the FPGA's built-in power management features, such as the power analyzer and power estimator, to monitor and optimize power consumption. For thermal performance, ensure good airflow around the FPGA, and consider using a heat sink or thermal interface material if necessary.
  • For high-speed interfaces, use differential pairs for signal transmission, and ensure that the PCB layout and routing meet the interface's signal integrity requirements. Additionally, use the FPGA's built-in interface-specific IP cores, such as the PCIe and DDR3 IP cores, and follow the interface's specification and protocol requirements.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

M2GL060-FGG676I Overview

Use the download button to access the M2GL060-FGG676I schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like M2GL0, or try a keyword search, such as Field Programmable Gate Arrays

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

Parts related to M2GL060-FGG676I

Showing 0 results

M2GL060-FGG676I Alternates

Showing results

Image Part Number Model
Part Image M2GL060FGG676I Microchip Technology Inc

Field Programmable Gate Array, PBGA676

Part Image M2GL060FG676I Microchip Technology Inc

Field Programmable Gate Array, PBGA676

Part Image M2GL060-FGG676I Microsemi Corporation (now Microchip)

Field Programmable Gate Array, PBGA676