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M2GL150-FC1152I - Microsemi Corporation

Description: IGLOO2 Field Programmable Gate Array (FPGA) IC 574 5120000 146124 1152-BBGA, FCBGA

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M2GL150-FC1152I - Microsemi Corporation PCB footprint - BGA - BGA - FC1152_1
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M2GL150-FC1152I - Microsemi Corporation  - 3D model - BGA - FC1152_1
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M2GL150-FC1152I Details

  • Manufacturer Part Number:

    M2GL150-FC1152I

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    35 X 35 MM, 1 MM PITCH, FBGA-1152

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-30 Code:

    S-PBGA-B1152

  • Length:

    35 mm

  • Number of Inputs:

    574

  • Number of Logic Cells:

    146124

  • Number of Outputs:

    574

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    240

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.9 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    35 mm

M2GL150-FC1152I Frequently Asked Questions (FAQs)

  • Microsemi provides a PCB design guide for the M2GL150-FC1152I, which recommends a 4-6 layer stack-up with a minimum of 2 mil trace width and 2 mil spacing. It's essential to follow the guide to ensure signal integrity and minimize electromagnetic interference (EMI).
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the Microsemi LX7160, which provides a reset signal to the FPGA during power-up. The POR circuit should be designed to ensure a clean reset signal, even in the presence of power supply noise or brownout conditions.
  • The M2GL150-FC1152I has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to implement proper thermal management, such as using a heat sink, thermal interface material, and ensuring good airflow around the device. Microsemi provides thermal modeling tools to help with thermal design.
  • To optimize the clock tree, use the Microsemi Libero SoC design software to implement a clock tree synthesis (CTS) strategy. This involves defining clock domains, specifying clock frequencies, and using the software's automated clock tree optimization features to minimize skew and jitter.
  • To implement a reliable JTAG interface, ensure that the JTAG signals are properly terminated, and the signal lines are short and matched. Use a JTAG connector with a 1:1 signal ratio, and consider using a JTAG signal repeater or buffer to improve signal integrity. Microsemi provides guidelines for JTAG interface design in their documentation.

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M2GL150-FC1152I Overview

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