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M2GL150T-FCV484I - Microsemi Corporation

Description: IGLOO2 Field Programmable Gate Array (FPGA) IC 248 5120000 146124 484-BFBGA

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M2GL150T-FCV484I - Microsemi Corporation PCB footprint - BGA - BGA - FCV484
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M2GL150T-FCV484I - Microsemi Corporation  - 3D model - BGA - FCV484
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M2GL150T-FCV484I Details

  • Manufacturer Part Number:

    M2GL150T-FCV484I

  • Rohs Code:

    No

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA, BGA484,22X22,32

  • Reach Compliance Code:

    Compliant

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    19 mm

  • Number of Terminals:

    484

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    240

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.15 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    19 mm

M2GL150T-FCV484I Frequently Asked Questions (FAQs)

  • Microsemi provides a PCB design guide and layout recommendations in their documentation, including guidelines for signal integrity, power distribution, and thermal management. It's essential to follow these guidelines to ensure reliable operation and minimize signal degradation.
  • Microsemi recommends using an external POR circuit with a voltage supervisor IC, such as the MIC2777, to ensure a reliable power-on reset. The FPGA also has an internal POR circuit, but it's recommended to use an external circuit for added reliability.
  • The M2GL150T-FCV484I has a thermal design power (TDP) of 12W. To ensure proper heat dissipation, use a heat sink with a thermal interface material, and follow Microsemi's thermal management guidelines, including recommendations for airflow, temperature monitoring, and thermal simulation.
  • The M2GL150T-FCV484I has a flexible clocking architecture with multiple clock domains. Microsemi provides a clocking architecture guide that explains the different clocking options, including the use of internal oscillators, external clock sources, and clock multiplication. The choice of clocking architecture depends on the specific application requirements and trade-offs between clock frequency, jitter, and power consumption.
  • The M2GL150T-FCV484I has a range of security features, including secure boot, encryption, and authentication. Microsemi provides a security user guide that explains how to implement secure boot, encrypt configuration data, and use the FPGA's built-in security features, such as the Advanced Encryption Standard (AES) and the Secure Hash Algorithm (SHA).

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M2GL150T-FCV484I Overview

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