Part Image

M2S005-VFG256 - Microsemi Corporation

Description: FPGA - Field Programmable Gate Array M2S005-VFG256

Download M2S005-VFG256 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
M2S005-VFG256 - Microsemi Corporation PCB footprint - BGA - BGA - VF256
click to zoom
3D Models
M2S005-VFG256 - Microsemi Corporation  - 3D model - BGA - VF256
click to zoom

M2S005-VFG256 Details

  • Manufacturer Part Number:

    M2S005-VFG256

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    VFBGA-256

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    LG-MIN, WD-MIN

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    161

  • Number of Logic Cells:

    6060

  • Number of Outputs:

    161

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.56 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    14 mm

M2S005-VFG256 Frequently Asked Questions (FAQs)

  • Microsemi provides a reference design guide for the M2S005-VFG256, which includes recommendations for PCB layout, thermal management, and power delivery. It's essential to follow these guidelines to ensure optimal performance, reduce thermal issues, and prevent signal integrity problems.
  • Microsemi provides a Secure Boot and Firmware Encryption Application Note (DS1044) that outlines the steps to implement secure boot and firmware encryption on the M2S005-VFG256. This includes using the device's built-in security features, such as the Secure Boot ROM and AES encryption engine.
  • The M2S005-VFG256 is designed for high-reliability applications, but it's essential to understand the device's limitations and considerations for use in safety-critical applications. Microsemi provides a Reliability and Quality Report (DS1051) that outlines the device's reliability data, failure modes, and mitigation strategies. Additionally, engineers should consult the device's datasheet and application notes for specific guidance on using the device in safety-critical applications.
  • To optimize power consumption, engineers can use the device's power management features, such as dynamic voltage and frequency scaling, clock gating, and power gating. Microsemi provides a Power Management Application Note (DS1039) that outlines the steps to optimize power consumption on the M2S005-VFG256. Additionally, engineers can use the device's built-in power analysis tools to monitor and optimize power consumption.
  • Microsemi provides a Debug and Troubleshooting Application Note (DS1042) that outlines the best practices for debugging and troubleshooting the M2S005-VFG256. This includes using the device's built-in debug features, such as the Debug Access Port (DAP) and the System Debug Module (SDM). Engineers should also use industry-standard debug tools, such as JTAG and serial console interfaces, to debug and troubleshoot their designs.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

M2S005-VFG256 Overview

Use the download button to access the M2S005-VFG256 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like M2S00, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to M2S005-VFG256

Showing 0 results

M2S005-VFG256 Alternates

Showing results

Image Part Number Model
Part Image M2S005-VF256 Microchip Technology Inc

6060-Cell, CMOS, PBGA256

Part Image M2S005-VF256I Microsemi Corporation (now Microchip)

Field Programmable Gate Array, 6060-Cell, CMOS, PBGA256

Part Image M2S005-VFG256I Microsemi Corporation (now Microchip)

Field Programmable Gate Array, 6060-Cell, CMOS, PBGA256

Part Image M2S005-VF256 Microsemi Corporation (now Microchip)

Field Programmable Gate Array, 6060-Cell, CMOS, PBGA256