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M2S025-FG484I - Microsemi Corporation

Description: FPGA SmartFusion2 Family 27696 Cells 65nm Technology 1.2V 484-Pin FPBGA Tray

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M2S025-FG484I - Microsemi Corporation PCB footprint - BGA - BGA - FG484
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M2S025-FG484I - Microsemi Corporation  - 3D model - BGA - FG484
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M2S025-FG484I Details

  • Manufacturer Part Number:

    M2S025-FG484I

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-484

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e0

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    267

  • Number of Logic Cells:

    27696

  • Number of Outputs:

    267

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    240

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

M2S025-FG484I Frequently Asked Questions (FAQs)

  • Microsemi provides a PCB design guide and layout recommendations in their documentation, including guidelines for signal integrity, power distribution, and thermal management. It's essential to follow these guidelines to ensure reliable operation and minimize signal degradation.
  • The M2S025-FG484I FPGA supports secure boot and encryption through Microsemi's Secure Boot and Anti-Tamper (SBAT) technology. This requires implementing a secure boot process, using encryption and authentication mechanisms, and configuring the FPGA's security features according to Microsemi's guidelines.
  • The power consumption and thermal characteristics of the M2S025-FG484I FPGA depend on the specific application, clock frequency, and operating conditions. Microsemi provides power estimation tools and thermal modeling data to help designers estimate power consumption and thermal performance. It's essential to perform thorough power and thermal analysis to ensure reliable operation.
  • Microsemi provides a range of debugging and testing tools, including the Libero SoC Design Suite, which offers simulation, synthesis, and place-and-route capabilities. Additionally, the FPGA has built-in debugging features, such as the Microsemi Debug (MD) module, which allows for real-time debugging and monitoring of the design.
  • The M2S025-FG484I FPGA is designed to meet specific radiation and environmental requirements, including total ionizing dose (TID) and single-event effects (SEE). Microsemi provides detailed radiation and environmental specifications in their documentation, and designers should ensure that their application meets these requirements.

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M2S025-FG484I Overview

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Part Image M2S025-FG484Y Microchip Technology Inc

Field Programmable Gate Array, 23988-Cell, CMOS, PBGA484