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M2S025-VFG400 - Microsemi Corporation

Description: FPGA SmartFusion2 Family 27696 Cells 65nm Technology 1.2V 400-Pin VFBGA Tray

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M2S025-VFG400 - Microsemi Corporation PCB footprint - BGA - BGA - VF400
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M2S025-VFG400 - Microsemi Corporation  - 3D model - BGA - VF400
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M2S025-VFG400 Details

  • Manufacturer Part Number:

    M2S025-VFG400

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    VFBGA-400

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-30 Code:

    S-PBGA-B400

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    207

  • Number of Logic Cells:

    27696

  • Number of Outputs:

    207

  • Number of Terminals:

    400

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA400,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.51 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    17 mm

M2S025-VFG400 Frequently Asked Questions (FAQs)

  • Microsemi provides a reference design guide and thermal management guidelines in their application notes and user manuals. It's recommended to follow these guidelines to ensure optimal performance and thermal management.
  • Microsemi provides a software development kit (SDK) and documentation for programming and configuring the FPGA. Engineers can use the SDK to generate bitstreams, program the device, and verify the configuration using tools like Libero SoC or SoftConsole.
  • The M2S025-VFG400 requires a specific power sequencing and voltage regulation scheme to ensure proper operation. Engineers should refer to the datasheet and application notes for detailed information on power supply requirements and recommended voltage regulators.
  • To ensure signal integrity and minimize noise, engineers should follow best practices for PCB design, such as using differential signaling, impedance matching, and shielding. They should also consider using signal integrity analysis tools and simulation software to optimize their design.
  • The M2S025-VFG400 is designed to meet specific radiation and environmental testing requirements for aerospace and defense applications. Engineers should refer to the datasheet and relevant industry standards (e.g., MIL-STD-883) for detailed information on testing and qualification requirements.

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M2S025-VFG400 Overview

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Part Image M2S025-VF400I Microsemi Corporation (now Microchip)

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Part Image M2S025-VF400Y Microchip Technology Inc

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