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M2S090-FGG484I - Microsemi Corporation

Description: FPGA SmartFusion2 Family 86184 Cells 65nm Technology 1.2V 484-Pin FPBGA Tray

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M2S090-FGG484I - Microsemi Corporation PCB footprint - BGA - BGA - FG484 MS-034 VAR AAJ-1
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3D Models
M2S090-FGG484I - Microsemi Corporation  - 3D model - BGA - FG484 MS-034 VAR AAJ-1
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M2S090-FGG484I Details

  • Manufacturer Part Number:

    M2S090-FGG484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-484

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    267

  • Number of Logic Cells:

    86316

  • Number of Outputs:

    267

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    23 mm

M2S090-FGG484I Frequently Asked Questions (FAQs)

  • Microsemi provides a PCB design guide that includes layout and routing guidelines for the M2S090-FGG484I. It's recommended to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the Microsemi LX7167, which provides a reset signal to the FPGA during power-up. The POR circuit should be designed to ensure that the FPGA is held in reset until the power supply voltages are stable.
  • The M2S090-FGG484I has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal interfaces, and airflow management. Microsemi provides thermal modeling and simulation tools to help with thermal design.
  • Microsemi provides a range of security features, including AES encryption, secure boot, and anti-tamper protection. Additionally, designers can implement their own security measures, such as secure key storage and access control, to protect their IP and prevent unauthorized access.
  • The M2S090-FGG484I is designed to withstand the harsh radiation environments found in space and aerospace applications. It features radiation-hardened flip-flops, memory, and other components, which provide immunity to single-event effects (SEEs) and total ionizing dose (TID) effects.

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M2S090-FGG484I Overview

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Part Image M2S090-FGG484 Microsemi Corporation (now Microchip)

Field Programmable Gate Array, 86316-Cell, CMOS, PBGA484

Part Image M2S090-FG484 Microsemi Corporation (now Microchip)

Field Programmable Gate Array, 86316-Cell, CMOS, PBGA484