M2S090TS-1FCS325I - Microsemi Corporation

M2S090TS-1FCS325I Details

• Manufacturer Part Number:

  M2S090TS-1FCS325I

• Part Life Cycle Code:

  Transferred

• Package Description:

  FBGA-325

• HTS Code:

  8542.31.00.60

• Manufacturer:

  Microsemi Corporation (now Microchip)

• Additional Feature:

  LG-MIN, WD-MIN

• JESD-30 Code:

  R-PBGA-B325

• JESD-609 Code:

  e0

• Length:

  13.5 mm

• Number of Inputs:

  180

• Number of Logic Cells:

  86316

• Number of Outputs:

  180

• Number of Terminals:

  325

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA325,21X21,20

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  240

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.16 mm

• Supply Voltage-Max:

  1.26 V

• Supply Voltage-Min:

  1.14 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Lead (Sn/Pb)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  11 mm