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M4FR5969SPHPT-MLS - Texas Instruments

Description: 16-bit Microcontrollers - MCU Radiation Hardened Mixed-Signal Microcontroller 48-HTQFP -55 to 105

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M4FR5969SPHPT-MLS - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PHP0048C
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M4FR5969SPHPT-MLS - Texas Instruments  - 3D model - Quad Flat Packages - PHP0048C
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M4FR5969SPHPT-MLS Details

  • Manufacturer Part Number:

    M4FR5969SPHPT-MLS

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    40

  • Number of Terminals:

    48

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    2048

  • ROM (words):

    0

  • ROM Programmability:

    FRAM

  • Seated Height-Max:

    1.2 mm

  • Speed:

    16 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

M4FR5969SPHPT-MLS Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal simulation tools to optimize the PCB design.
  • Operating the device at the maximum junction temperature (TJ) can reduce its lifespan. It is recommended to operate the device at a lower TJ to ensure reliable operation and extend its lifespan.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input/output pins to protect the device from electrostatic discharge. Follow proper PCB design and handling practices to minimize ESD risks.
  • Ensure that the power supplies are sequenced correctly to prevent damage to the device. The voltage ramp-up should be controlled to prevent inrush currents and ensure reliable operation.

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M4FR5969SPHPT-MLS Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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