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M4FR5969SRGZT-MLS - Texas Instruments

Description: Radiation Hardened Mixed-Signal Microcontroller

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PCB Footprints
M4FR5969SRGZT-MLS - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGZ0048B
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3D Models
M4FR5969SRGZT-MLS - Texas Instruments  - 3D model - Quad Flat No-Lead - RGZ0048B
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M4FR5969SRGZT-MLS Details

  • Manufacturer Part Number:

    M4FR5969SRGZT-MLS

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Date Of Intro:

    2017-12-31

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    1

  • Number of I/O Lines:

    40

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    48

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    2048

  • RAM (words):

    2

  • ROM (words):

    0

  • ROM Programmability:

    FRAM

  • Seated Height-Max:

    1 mm

  • Speed:

    16 MHz

  • Supply Current-Max:

    1.62 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

M4FR5969SRGZT-MLS Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink. The datasheet provides some guidelines, but a more detailed application note from TI (SLMA002) provides additional guidance.
  • In addition to following the recommended operating conditions, ensure that the device is properly decoupled, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermistor or thermocouple to monitor the device temperature.
  • The 'MLS' package is a Micro Lead Frame (MLF) package, which has a smaller footprint than traditional QFN packages. This requires more careful PCB design to ensure good thermal performance and to prevent solder bridging during assembly.
  • The M4FR5969SRGZT-MLS has a high current rating, which requires careful PCB design to ensure that the traces and vias can handle the current. Use a PCB design tool to simulate the current flow and ensure that the traces are wide enough to handle the current.
  • The M4FR5969SRGZT-MLS is a high-frequency device, which can generate electromagnetic interference (EMI). Ensure that the PCB is designed with EMI in mind, using techniques such as shielding, grounding, and filtering to minimize EMI.

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M4FR5969SRGZT-MLS Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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