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MAT14ARZ - Analog Devices

Description: Bipolar Transistors - BJT Matched Monolithic Quad Transistor

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MAT14ARZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - R-14 (SOIC)
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MAT14ARZ - Analog Devices  - 3D model - Small Outline Packages - R-14 (SOIC)
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MAT14ARZ Details

  • Manufacturer Part Number:

    MAT14ARZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, SOIC_N-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    R-14

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.95

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    LOW NOISE

  • Collector Current-Max (IC):

    0.03 A

  • Collector-Emitter Voltage-Max:

    40 V

  • Configuration:

    COMPLEX

  • DC Current Gain-Min (hFE):

    200

  • JEDEC-95 Code:

    MS-012AB

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    300 MHz

MAT14ARZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure that the device is operated within the specified temperature range and that the junction temperature is kept below 150°C.
  • A 10nF to 100nF input capacitance is recommended to filter out high-frequency noise and ensure stable operation.
  • Use a shielded enclosure, keep the device away from high-frequency sources, and ensure that the PCB layout is optimized for minimal radiation. Implement EMI filters and shielding on the input and output lines.
  • A 10uF to 100uF output capacitance is recommended to filter out high-frequency noise and ensure stable operation.

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MAT14ARZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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