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MAX11261ENX+T - Analog Devices

Description: Analog to Digital Converters - ADC 24-Bit, 6-Channel, 64ksps, Delta-Sigma ADC with PAG and I2C and SPI Interface

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PCB Footprints
MAX11261ENX+T - Analog Devices PCB footprint - BGA - BGA - N362B2+2-1
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3D Models
MAX11261ENX+T - Analog Devices  - 3D model - BGA - N362B2+2-1
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MAX11261ENX+T Details

  • Manufacturer Part Number:

    MAX11261ENX+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    36-WLCSP-N/A

  • Package Description:

    WLP-36

  • Pin Count:

    36

  • Manufacturer Package Code:

    36-WLCSP-N/A

  • HTS Code:

    8542.39.00.30

  • Date Of Intro:

    2018-05-10

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Input Voltage-Max:

    3.6 V

  • Analog Input Voltage-Min:

    -1.5 V

  • Converter Type:

    ADC, DELTA-SIGMA

  • JESD-30 Code:

    S-XBGA-B36

  • Length:

    2.838 mm

  • Linearity Error-Max (EL):

    0.0015%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    6

  • Number of Bits:

    24

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2'S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA36,6X6,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    0.016 MHz

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max:

    5.65 mA

  • Supply Voltage-Nom:

    3.465 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.838 mm

MAX11261ENX+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX11261ENX+T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and to minimize the length of the analog signal traces.
  • To properly configure the MAX11261ENX+T, you need to consider factors such as the input signal range, sampling rate, and output data format. You can use the device's SPI interface to configure the device's registers and set the desired parameters. Refer to the device's datasheet and application notes for more information on configuration and programming.
  • The MAX11261ENX+T can handle input voltages up to ±5V, but it's recommended to keep the input voltage within the specified range of ±3.5V to ensure optimal performance and accuracy.
  • To ensure the accuracy and reliability of the MAX11261ENX+T's measurements, it's essential to follow proper calibration and testing procedures. This includes calibrating the device using a known reference signal, verifying the device's performance using a test signal, and implementing error detection and correction mechanisms in your application.
  • The MAX11261ENX+T is rated for operation up to 125°C, but its performance and accuracy may degrade at higher temperatures. It's recommended to consult the device's datasheet and application notes for more information on temperature-related specifications and limitations.

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MAX11261ENX+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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