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MAX1147BCUP+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX1147BCUP+ - Analogue to Digital Converter, 14 bit, 116 kSPS, Differential, Single Ended, SPI, Single, 2.7 V

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MAX1147BCUP+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U20-3-1
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MAX1147BCUP+ - Analog Devices  - 3D model - Small Outline Packages - U20-3-1
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MAX1147BCUP+ Details

  • Manufacturer Part Number:

    MAX1147BCUP+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    20-TSSOP_4.4-4.4_MM

  • Package Description:

    4.40 MM, MO-153-AC, TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    20-TSSOP_4.4-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.30

  • Date Of Intro:

    2004-11-12

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    2.52 V

  • Conversion Time-Max:

    8 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Linearity Error-Max (EL):

    0.0122%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    2

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    BINARY, 2'S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.11666 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX1147BCUP+ Frequently Asked Questions (FAQs)

  • A good layout and routing practice for the MAX1147BCUP+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the analog signal traces. Additionally, it's recommended to place the device close to the analog signal sources and to use a low-ESR capacitor for the VCC pin.
  • The MAX1147BCUP+ has several configuration options, including gain settings, filter bandwidth, and output coding. To properly configure the device, engineers should consult the datasheet and application notes, and consider factors such as signal amplitude, frequency, and desired output format. Trade-offs between different configuration options may include noise performance, power consumption, and output resolution.
  • Potential sources of error and inaccuracy in the MAX1147BCUP+ include noise, offset voltage, gain error, and nonlinearity. These can be mitigated by using proper layout and routing, selecting the appropriate gain setting, and calibrating the device. Additionally, engineers can use techniques such as averaging and filtering to reduce the impact of noise and other errors.
  • The MAX1147BCUP+ has built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) mechanisms. The OVP circuitry protects the device from input voltages exceeding 6V, while the UVLO circuitry prevents the device from operating when the supply voltage falls below 2.7V. Additionally, engineers can use external protection circuits, such as voltage regulators and TVS diodes, to further protect the device from voltage transients and surges.
  • The MAX1147BCUP+ has a maximum operating temperature range of -40°C to +125°C. To ensure reliable operation over temperature, engineers should consider factors such as power dissipation, thermal resistance, and package thermal design. This may involve using thermal vias, heat sinks, and thermal interface materials, as well as selecting a suitable PCB material and design.

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MAX1147BCUP+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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