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MAX1168BCEG+ - Analog Devices

Description: Multichannel, 16-Bit, 200ksps Analog-to-Digital Converters

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MAX1168BCEG+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - qsop24
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MAX1168BCEG+ - Analog Devices  - 3D model - Small Outline Packages - qsop24
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MAX1168BCEG+ Details

  • Manufacturer Part Number:

    MAX1168BCEG+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    24-QSOP-150_MIL

  • Package Description:

    QSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    24-QSOP-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.30

  • Date Of Intro:

    2003-08-29

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Input Voltage-Max:

    5.05 V

  • Conversion Time-Max:

    7.07 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Linearity Error-Max (EL):

    0.0046%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    8

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP24,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.2 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX1168BCEG+ Frequently Asked Questions (FAQs)

  • The MAX1168BCEG+ is a high-speed, high-precision ADC, and as such, it requires careful layout and placement to minimize noise and ensure optimal performance. It is recommended to follow the layout guidelines provided in the datasheet, including keeping the analog and digital grounds separate, using a solid ground plane, and placing the ADC as close as possible to the analog signal sources. Additionally, it is recommended to use a low-noise, low-impedance power supply and to decouple the power pins with high-quality capacitors.
  • The MAX1168BCEG+ has an internal calibration mechanism that can be used to achieve high accuracy and linearity. The calibration process involves applying a known input voltage to the ADC and then using the calibration registers to adjust the ADC's gain and offset. The datasheet provides a detailed calibration procedure, and it is recommended to follow this procedure carefully to achieve the highest accuracy and linearity. Additionally, it is recommended to use a high-quality, low-noise reference voltage source and to calibrate the ADC at multiple temperatures to ensure optimal performance over the entire operating range.
  • The MAX1168BCEG+ is a high-speed ADC that can achieve sampling rates of up to 100Msps. However, the maximum sampling rate that can be achieved in a particular application will depend on the specific use case and the performance of the surrounding circuitry. The datasheet provides guidelines for achieving high-speed operation, including the use of a high-quality clock source, careful layout and placement, and the use of a low-jitter clock signal. Additionally, the ADC's performance will be limited by the quality of the analog input signal, and it is recommended to use a high-quality, low-noise signal source to achieve the highest performance.
  • The MAX1168BCEG+ can be interfaced with a microcontroller or FPGA using a variety of interfaces, including SPI, I2C, and parallel interfaces. The key considerations when interfacing the ADC with a microcontroller or FPGA include the clock speed, data transfer rate, and synchronization. It is recommended to use a high-speed interface, such as SPI, to achieve the highest data transfer rates. Additionally, it is important to ensure that the microcontroller or FPGA can handle the high-speed data output of the ADC, and that the interface is properly synchronized to avoid data loss or corruption.
  • The MAX1168BCEG+ has a typical power consumption of 350mW at a sampling rate of 100Msps. The power consumption can be optimized by reducing the sampling rate, using the ADC's power-down mode, and optimizing the surrounding circuitry. The thermal characteristics of the ADC are also important, and it is recommended to use a high-quality thermal interface material and to ensure good airflow around the device to prevent overheating. The datasheet provides detailed information on the power consumption and thermal characteristics of the ADC, and it is recommended to follow the guidelines provided to optimize performance and reliability.

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MAX1168BCEG+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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