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MAX14571EUD+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX14571EUD+ - Overvoltage & Overcurrent Protector, 4.5 V to 3.6 V in, TSSOP-14

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MAX14571EUD+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U14E+3
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MAX14571EUD+ - Analog Devices  - 3D model - Small Outline Packages - U14E+3
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MAX14571EUD+ Details

  • Manufacturer Part Number:

    MAX14571EUD+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    14-TSSOP_4.4_EP-4.4_MM

  • Package Description:

    5 X 6.50 MM, ROHS COMPLIANT, TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    14-TSSOP_4.4_EP-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2012-11-08

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.7 mA

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    24 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX14571EUD+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX14571EUD+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals, and to minimize the length of the traces connecting the device to the power supply and other components.
  • To ensure proper power-up and configuration, it's recommended to follow a specific power-up sequence, which involves applying the power supply voltage to the device before applying the input signals. Additionally, the device should be configured in a specific order, such as setting the output voltage and then enabling the output. The datasheet provides a detailed power-up sequence and configuration procedure.
  • The MAX14571EUD+ has a maximum junction temperature of 150°C, and it's recommended to keep the device temperature below 125°C for optimal performance and reliability. To ensure this, it's recommended to provide adequate heat sinking, such as using a thermal pad or a heat sink, and to keep the device away from other heat sources. Additionally, the device's thermal resistance can be calculated using the thermal resistance values provided in the datasheet.
  • To troubleshoot issues with the MAX14571EUD+, it's recommended to follow a systematic approach, starting with checking the power supply voltage and input signals. Then, verify the device configuration and output voltage settings. If the issue persists, check for any signs of overheating, such as excessive temperature or thermal shutdown. Finally, consult the datasheet and application notes for troubleshooting guides and FAQs.
  • Yes, the MAX14571EUD+ is a high-frequency device and requires careful consideration of EMI/EMC issues. To ensure compliance with regulatory standards, it's recommended to follow proper PCB layout and design practices, such as using shielding, filtering, and grounding techniques. Additionally, the device's output should be filtered and decoupled to minimize EMI emissions. Consult the datasheet and application notes for EMI/EMC guidelines and recommendations.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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