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MAX14572EUD+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX14572EUD+T - Overvoltage & Overcurrent Protector, 4.5V to 36V, TSSOP-14

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MAX14572EUD+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U14E+3
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MAX14572EUD+T - Analog Devices  - 3D model - Small Outline Packages - U14E+3
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MAX14572EUD+T Details

  • Manufacturer Part Number:

    MAX14572EUD+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    14-TSSOP_4.4_EP-4.4_MM

  • Pin Count:

    14

  • Manufacturer Package Code:

    14-TSSOP_4.4_EP-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2012-11-08

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.7 mA

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    24 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX14572EUD+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX14572EUD+T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the battery. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for power and ground to reduce noise and EMI.
  • The MAX14572EUD+T has a thermal pad on the bottom of the package that should be connected to a thermal plane on the PCB. This helps to dissipate heat generated by the device. Additionally, it's recommended to use a heat sink or thermal interface material to further reduce the thermal resistance.
  • The recommended input capacitor value for the MAX14572EUD+T is 10uF to 22uF, with a voltage rating of at least 6.3V. The capacitor should be placed as close to the device as possible to reduce noise and ripple.
  • Yes, the MAX14572EUD+T has a low quiescent current of 1.5uA, making it suitable for battery-powered devices. However, it's recommended to use a power-down mode or shutdown pin to further reduce the quiescent current when the device is not in use.
  • To troubleshoot issues with the MAX14572EUD+T, start by checking the input voltage and current, as well as the output voltage and current. Verify that the device is properly configured and that the input and output capacitors are properly sized. Use an oscilloscope to check for noise and ripple on the output voltage. If the issue persists, consult the datasheet and application notes for further guidance.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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