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MAX14759ETA+T - Analog Devices

Description: Above- and Below-the-Rails Low On-Resistance Analog Switches

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MAX14759ETA+T - Analog Devices - PCB symbol
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PCB Footprints
MAX14759ETA+T - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - 8 TDFN T833+2
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3D Models
MAX14759ETA+T - Analog Devices - 3D model - Small Outline No-lead - 8 TDFN T833+2
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MAX14759ETA+T Details

  • Manufacturer Part Number:

    MAX14759ETA+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-LFCSP-3X3X0.75

  • Package Description:

    TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-LFCSP-3X3X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2011-10-21

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Off-state Isolation-Nom:

    77 dB

  • On-state Resistance Match-Nom:

    0.0024 Ω

  • On-state Resistance-Max (Ron):

    1 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Signal Current-Max:

    0.5 A

  • Supply Current-Max (Isup):

    10 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    1000000 ns

  • Switch-on Time-Max:

    300000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX14759ETA+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX14759ETA+T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals, and to minimize the length of the traces connecting the device to the power source and load.
  • To ensure proper power-up and configuration, it's recommended to follow a specific power-up sequence, which involves applying the power supply voltage (VCC) before the input voltage (VIN). Additionally, the EN pin should be pulled high after VCC has reached its nominal value, and the device should be configured through the I2C interface after the EN pin has been pulled high.
  • The MAX14759ETA+T can deliver up to 2A of current to the load, depending on the input voltage and output voltage settings. In case of an overcurrent condition, the device has a built-in overcurrent protection (OCP) feature that limits the output current to prevent damage to the device or the load. The OCP threshold can be adjusted through the I2C interface.
  • The MAX14759ETA+T has a built-in undervoltage lockout (UVLO) feature that prevents the device from operating when the input voltage falls below a certain threshold (typically around 2.5V). Additionally, the device has a soft-start feature that helps to reduce the inrush current during power-up and input voltage transients.
  • The MAX14759ETA+T has a maximum junction temperature (TJ) rating of 150°C, and it's recommended to keep the device temperature below 125°C for reliable operation. To ensure reliable operation in high-temperature environments, it's recommended to use a heat sink, reduce the power dissipation, and use a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.

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MAX14759ETA+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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