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MAX14783EAUA+ - Analog Devices

Description: RS-422/RS-485 Interface IC High-Spd 3.3V/5V w/ 35kV HBM ESD Protect

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MAX14783EAUA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U8+1
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MAX14783EAUA+ - Analog Devices  - 3D model - Small Outline Packages - U8+1
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MAX14783EAUA+ Details

  • Manufacturer Part Number:

    MAX14783EAUA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-MINI_SO-N/A

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-MINI_SO-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2013-06-28

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    25 ns

  • Receiver Number of Bits:

    1

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    20 ns

MAX14783EAUA+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX14783EAUA+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals, and to minimize the length of the traces connecting the device to the power source and load.
  • To ensure the stability of the output voltage, it's essential to use a suitable output capacitor with a low equivalent series resistance (ESR) and a high ripple current rating. Additionally, the output capacitor should be placed close to the device, and the input capacitor should be selected based on the input voltage and current requirements.
  • The MAX14783EAUA+ can handle an input voltage up to 5.5V, but it's recommended to operate the device within the specified input voltage range of 2.7V to 5.5V to ensure reliable operation and to prevent damage to the device.
  • The output voltage of the MAX14783EAUA+ can be programmed using an external resistor divider network connected to the FB pin. The output voltage can be calculated using the formula: VOUT = 0.8V x (1 + R1/R2), where R1 and R2 are the resistors in the divider network.
  • The typical startup time of the MAX14783EAUA+ is around 1ms, but this can vary depending on the input voltage, output voltage, and load current. It's recommended to check the device's datasheet for more information on the startup time and to ensure that the device is properly powered up before enabling the load.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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