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MAX14882AWE+T - Analog Devices

Description: CAN Interface IC Isolated CAN Transceiver with Transformer Driver

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MAX14882AWE+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16 SO (W16#H2)
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3D Models
MAX14882AWE+T - Analog Devices  - 3D model - Small Outline Packages - 16 SO (W16#H2)
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MAX14882AWE+T Details

  • Manufacturer Part Number:

    MAX14882AWE+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-SOIC_W-300_MIL

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-SOIC_W-300_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2018-05-29

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Data Rate:

    1000 Mbps

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    130 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    CAN TRANSCEIVER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

MAX14882AWE+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX14882AWE+T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals, and to minimize the length of the traces connecting the device to the power supply and other components.
  • To ensure proper power-up and configuration, it's recommended to follow a specific power-up sequence, which involves applying the power supply voltage to the device before applying the input signals. Additionally, the device should be configured in a specific order, such as setting the clock frequency and then enabling the transmitter.
  • Common pitfalls to avoid when designing with the MAX14882AWE+T include not following the recommended PCB layout, not using a sufficient decoupling capacitor, and not properly terminating the transmission lines. Additionally, not accounting for the device's power consumption and heat dissipation can also lead to design issues.
  • To troubleshoot issues with the MAX14882AWE+T, it's recommended to use a logic analyzer or oscilloscope to monitor the device's signals and identify the source of the problem. Additionally, checking the device's power supply voltage, clock frequency, and input signal integrity can help identify the root cause of the issue.
  • Yes, when designing with the MAX14882AWE+T, it's important to take into account EMI/EMC considerations such as using a shielded enclosure, minimizing the length of the transmission lines, and using EMI filters or chokes to reduce electromagnetic radiation.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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